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For the Inventor, By the Inventor

Hillsboro, OR, United States of America

Alexander William Simpson

USPTO Granted Patents = 26 

 

Average Co-Inventor Count = 3.6

ph-index = 9

Forward Citations = 223(Granted Patents)


Location History:

  • Wappingers Falls, NY (US) (2001 - 2006)
  • Warrenville, IL (US) (2004 - 2007)
  • Glen Allen, VA (US) (2009)
  • Hillsboro, OR (US) (2013 - 2019)

Company Filing History:

goldMedal9 out of 33 
 
Nexplanar Corporation
 patents
silverMedal5 out of 297 
 
Cabot Microelectronics Corporation
 patents
bronzeMedal5 out of 14,705 
 
Infineon Technologies Ag
 patents
4. 3 out of 164,108 
 
International Business Machines Corporation
 patents
5. 1 out of 1 
 
Infineon Technologies Aktientgesellschaft
 patent
6. 3 out of 832,680 
Other
 patents

Years Active: 2001-2019

where 'Filed Patents' based on already Granted Patents

26 patents (USPTO):
1. 10293459 - Polishing pad having polishing surface with continuous protrusions (2019-05-21),
2. 10160092 - Polishing pad having polishing surface with continuous protrusions having tapered sidewalls (2018-12-25),
3. 9931728 - Polishing pad with foundation layer and polishing surface layer (2018-04-03),
4. 9649742 - Polishing pad having polishing surface with continuous protrusions (2017-05-16),
5. 9597777 - Homogeneous polishing pad for eddy current end-point detection (2017-03-21),
6. 9597769 - Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer (2017-03-21),
7. 9211628 - Polishing pad with concentric or approximately concentric polygon groove pattern (2015-12-15),
8. 9067297 - Polishing pad with foundation layer and polishing surface layer (2015-06-30),
9. 9028302 - Polishing pad for eddy current end-point detection (2015-05-12),
10. 8657653 - Homogeneous polishing pad for eddy current end-point detection (2014-02-25),
11. 8628384 - Polishing pad for eddy current end-point detection (2014-01-14),
12. 8439994 - Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection (2013-05-14),
13. 7582127 - Polishing composition for a tungsten-containing substrate (2009-09-01),
14. 7247567 - Method of polishing a tungsten-containing substrate (2007-07-24),
15. 7011574 - Polyelectrolyte dispensing polishing pad (2006-03-14),

Title: The Innovative Mind of Alexander William Simpson

Introduction: Alexander William Simpson, a talented inventor hailing from Hillsboro, Oregon, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Alexander William Simpson's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to reduce carbon emissions.

Career Highlights: Throughout his illustrious career, Alexander William Simpson has consistently pushed the boundaries of technological advancement. His work has garnered international recognition and has been instrumental in shaping the future of various industries.

Collaborations: Alexander William Simpson has collaborated with leading tech companies, research institutions, and universities to further his innovative projects. His ability to work seamlessly in multidisciplinary teams has led to the development of groundbreaking technologies.

Conclusion: Alexander William Simpson's passion for innovation and his relentless drive to create a positive impact on society through his inventions make him a true pioneer in the world of technology. His work continues to inspire future generations of inventors and innovators.

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