The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 14, 2013
Filed:
Sep. 30, 2010
Applicants:
William C. Allison, Beaverton, OR (US);
Diane Scott, Portland, OR (US);
Ping Huang, Eden Prairie, MN (US);
Richard Frentzel, Murrieta, CA (US);
Alexander William Simpson, Hillsboro, OR (US);
Inventors:
William C. Allison, Beaverton, OR (US);
Diane Scott, Portland, OR (US);
Ping Huang, Eden Prairie, MN (US);
Richard Frentzel, Murrieta, CA (US);
Alexander William Simpson, Hillsboro, OR (US);
Assignee:
NexPlanar Corporation, Hillsboro, OR (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01); B24D 3/00 (2006.01); B24D 18/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Methods of fabricating polishing pads with end-point detection regions for polishing semiconductor substrates using eddy current end-point detection are described.
Allison, William. (2013). Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection (U.S. Patent No. 8439994). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8439994
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile