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Aurora, IL, United States of America

Cabot Microelectronics Corporation

USPTO Granted Patents = 297

% Expired Patents = 24.9

EPO Patents = 98

Trademarks = 19

Forward Citations = 2,802

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206 inventors (with patents filed for the assignee):

Steven Grumbine (51 out of 62 patents)

Shumin Wang (33 out of 38 patents)

Jeffrey Dysard (32 out of 33 patents)

4. Phillip W Carter (27 out of 35 patents)

5. Abaneshwar Prasad (19 out of 19 patents)

6. Kevin J Moeggenborg (18 out of 33 patents)

7. William J Ward (17 out of 34 patents)

8. Vlasta A Brusic (17 out of 31 patents)

9. Brian Reiss (16 out of 24 patents)

10. Vlasta Brusic Kaufman (16 out of 23 patents)

11. Brian L Mueller (15 out of 31 patents)

12. Isaac K Cherian (15 out of 15 patents)

13. Michael L White (14 out of 38 patents)

14. Timothy P Johns (13 out of 14 patents)

15. Francesco De Rege Thesauro (13 out of 14 patents)

Core Competencies:

Chemical-Mechanical Polishing

Tungsten CMP

Silicon Polishing

Dielectric Substrate

Polishing Compositions

Ceria Abrasive

Nickel-Phosphorous

STI Applications

Corrosion Inhibitors

Polishing Pads

Cobalt Processing

Aluminum-Copper Structures

297 patents: Sort by Forward Citations

1. 10792785 - Chemical-mechanical processing slurry and methods for processing a nickel substrate surface (2020-10-06),

2. 10676647 - Composition for tungsten CMP (2020-06-09),

3. 10647887 - Tungsten buff polishing compositions with improved topography (2020-05-12),

4. 10640680 - Chemical-mechanical processing slurry and methods (2020-05-05),

5. 10640679 - CMP compositions selective for oxide and nitride with improved dishing and pattern selectivity (2020-05-05),

6. 10639766 - Methods and compositions for processing dielectric substrate (2020-05-05),

7. 10619076 - Self-stopping polishing composition and method for bulk oxide planarization (2020-04-14),

8. 10619075 - Self-stopping polishing composition and method for bulk oxide planarization (2020-04-14),

9. 10584266 - CMP compositions containing polymer complexes and agents for STI applications (2020-03-10),

10. 10562149 - Polyurethane CMP pads having a high modulus ratio (2020-02-18),

11. 10522341 - Composition and method for removing residue from chemical-mechanical planarization substrate (2019-12-31),

12. 10508219 - Polishing composition and method utilizing abrasive particles treated with an aminosilane (2019-12-17),

13. 10486124 - Systems for mixing a liquid and related methods (2019-11-26),

14. 10479911 - Composition and method for polishing memory hard disks exhibiting reduced edge roll off (2019-11-19),

15. 10418248 - Method of polishing group III-V materials (2019-09-17),

Company Overview

Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, specializes in advanced materials and solutions for the semiconductor industry, particularly in the field of chemical-mechanical polishing (CMP). The company focuses on developing innovative polishing compositions and abrasives, including ceria-based products, to enhance the performance of semiconductor manufacturing processes. Their expertise encompasses tungsten CMP, silicon polishing, and dielectric substrates, addressing critical applications such as STI (Shallow Trench Isolation) to meet the evolving demands of the technology landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

297 Patents

#1 in Aurora, IL

#87 in Illinois

#1,482 in US

#3,015 in the World

Aurora, IL, United States of America

Cabot Microelectronics Corporation

Forward Citations = 2,802

206 inventors:

Steven Grumbine (51 out of 62 patents)

Shumin Wang (33 out of 38 patents)

Jeffrey Dysard (32 out of 33 patents)

4. Phillip W Carter (27 out of 35 patents)

5. Abaneshwar Prasad (19 out of 19 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Cabot Microelectronics Corporation. Retrieved from https://idiyas.com/company/cabot-microelectronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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