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For the Inventor, By the Inventor

Aurora, IL, United States of America

Cabot Microelectronics Corporation


USPTO Granted Patents = 297

% Expired Patents = 24.9


Trademarks = 19

Forward Citations = 2,802

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206 inventors (with patents filed for the assignee):

goldMedal Steven Grumbine (51 out of 62 patents)

silverMedal Shumin Wang (33 out of 38 patents)

bronzeMedal Jeffrey Dysard (32 out of 33 patents)

4.  Phillip W Carter (27 out of 35 patents)

5.  Abaneshwar Prasad (19 out of 19 patents)

6.  Kevin J Moeggenborg (18 out of 33 patents)

7.  William J Ward (17 out of 34 patents)

8.  Vlasta A Brusic (17 out of 31 patents)

9.  Brian Reiss (16 out of 24 patents)

10.  Vlasta Brusic Kaufman (16 out of 23 patents)

11.  Brian L Mueller (15 out of 31 patents)

12.  Isaac K Cherian (15 out of 15 patents)

13.  Michael L White (14 out of 38 patents)

14.  Timothy P Johns (13 out of 14 patents)

15.  Francesco De Rege Thesauro (13 out of 14 patents)


Core Competencies:
Chemical-Mechanical Polishing
Tungsten CMP
Silicon Polishing
Dielectric Substrate
Polishing Compositions
Ceria Abrasive
Nickel-Phosphorous
STI Applications
Corrosion Inhibitors
Polishing Pads
Cobalt Processing
Aluminum-Copper Structures

297 patents:

1. 10792785 - Chemical-mechanical processing slurry and methods for processing a nickel substrate surface (2020-10-06),
2. 10676647 - Composition for tungsten CMP (2020-06-09),
3. 10647887 - Tungsten buff polishing compositions with improved topography (2020-05-12),
4. 10640680 - Chemical-mechanical processing slurry and methods (2020-05-05),
5. 10640679 - CMP compositions selective for oxide and nitride with improved dishing and pattern selectivity (2020-05-05),
6. 10639766 - Methods and compositions for processing dielectric substrate (2020-05-05),
7. 10619076 - Self-stopping polishing composition and method for bulk oxide planarization (2020-04-14),
8. 10619075 - Self-stopping polishing composition and method for bulk oxide planarization (2020-04-14),
9. 10584266 - CMP compositions containing polymer complexes and agents for STI applications (2020-03-10),
10. 10562149 - Polyurethane CMP pads having a high modulus ratio (2020-02-18),
11. 10522341 - Composition and method for removing residue from chemical-mechanical planarization substrate (2019-12-31),
12. 10508219 - Polishing composition and method utilizing abrasive particles treated with an aminosilane (2019-12-17),
13. 10486124 - Systems for mixing a liquid and related methods (2019-11-26),
14. 10479911 - Composition and method for polishing memory hard disks exhibiting reduced edge roll off (2019-11-19),
15. 10418248 - Method of polishing group III-V materials (2019-09-17),
Cabot Microelectronics Corporation, headquartered in Aurora, Illinois, specializes in advanced materials and solutions for the semiconductor industry, particularly in the field of chemical-mechanical polishing (CMP). The company focuses on developing innovative polishing compositions and abrasives, including ceria-based products, to enhance the performance of semiconductor manufacturing processes. Their expertise encompasses tungsten CMP, silicon polishing, and dielectric substrates, addressing critical applications such as STI (Shallow Trench Isolation) to meet the evolving demands of the technology landscape.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Cabot Microelectronics Corporation
297 Patents

#1 in Aurora, IL

#87 in Illinois

#1,479 in US

#3,006 in the World

Aurora, IL (US)
Aurora, IL, United States of America

Cabot Microelectronics Corporation

Forward Citations = 2,802

206 inventors:

goldMedal Steven Grumbine (51 out of 62 patents)

silverMedal Shumin Wang (33 out of 38 patents)

bronzeMedal Jeffrey Dysard (32 out of 33 patents)

4.  Phillip W Carter (27 out of 35 patents)

5.  Abaneshwar Prasad (19 out of 19 patents)

Please report any incorrect information to [email protected]
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