The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Sep. 23, 2016
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

Lin Fu, Naperville, IL (US);

Rui Ma, Naperville, IL (US);

Nathan Speer, Oak Park, IL (US);

Chen-Chih Tsai, Naperville, IL (US);

Kathryn Bergman, Chicago, IL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); B24B 37/04 (2012.01); B24B 37/22 (2012.01); B24D 18/00 (2006.01); B24B 37/14 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); B24B 37/042 (2013.01); B24B 37/22 (2013.01); B24B 37/14 (2013.01); B24D 18/0045 (2013.01);
Abstract

A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.


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