The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Jul. 08, 2010
Applicants:
William Allison, Beaverton, OR (US);
Diane Scott, Portland, OR (US);
Robert Kerprich, Portland, OR (US);
Ping Huang, St. Louis Park, MN (US);
Richard Frentzel, Murrieta, CA (US);
Inventors:
William Allison, Beaverton, OR (US);
Diane Scott, Portland, OR (US);
Robert Kerprich, Portland, OR (US);
Ping Huang, St. Louis Park, MN (US);
Richard Frentzel, Murrieta, CA (US);
Assignee:
NexPlanar Corporation, Hilsboro, OR (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01); B24B 37/20 (2012.01); B32B 7/06 (2006.01); B32B 27/06 (2006.01); B32B 27/36 (2006.01); B32B 3/30 (2006.01);
U.S. Cl.
CPC ...
B24B 37/205 (2013.01); B32B 3/30 (2013.01); B32B 7/06 (2013.01); B32B 27/065 (2013.01); B32B 27/36 (2013.01); B32B 2266/0278 (2013.01); B32B 2266/08 (2013.01); B32B 2457/00 (2013.01);
Abstract
Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.