Nexplanar Corporation

Cabot Microelectronics Corporation

Cmc Materials, Inc.

William C Allison

Diane Scott

Ping Huang

Alexander William Simpson

Paul Andre Lefevre

Robert Kerprich

Richard Frentzel

James P LaCasse

Leslie M Charns

Rajeev Bajaj

James Richard Rinehart

Jose Arno

Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.

Low density polishing pad

Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.

Polishing pad having polishing surface with continuous protrusions

Polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions having tapered sidewalls are also described.

Polishing pad having polishing surface with continuous protrusions having tapered sidewalls

Polishing pads with foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer. A polishing surface layer is bonded to the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a foundation layer are also described.

Polishing pad with foundation layer and polishing surface layer

Polishing pads with grooved foundation layers and polishing surface layers are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a pattern of grooves disposed therein. A continuous polishing surface layer is attached to the pattern of grooves of the foundation layer. In another example, a polishing pad for polishing a substrate includes a foundation layer with a surface having a pattern of protrusions disposed thereon. Each protrusion has a top surface and sidewalls. A non-continuous polishing surface layer is attached to the foundation layer and includes discrete portions. Each discrete portion is attached to the top surface of a corresponding one of the protrusions of the foundation layer. Methods of fabricating polishing pads with a polishing surface layer bonded to a grooved foundation layer are also described.

Polishing pad with grooved foundation layer and polishing surface layer

Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.

Polishing pad with foundation layer and window attached thereto

Homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are described. Methods of fabricating homogeneous polishing pads for polishing semiconductor substrates using eddy current end-point detection are also described.

Homogeneous polishing pad for eddy current end-point detection

Polishing pads with apertures are described. Methods of fabricating polishing pads with apertures are also described.

Method of fabricating a polishing

Polishing pads with a polishing surface layer having an aperture or opening above a transparent foundation layer are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a global top surface and a transparent region. A polishing surface layer is attached to the global top surface of the foundation layer. The polishing surface layer has a polishing surface and a back surface. An aperture is disposed in the polishing pad from the back surface through to the polishing surface of the polishing surface layer, and aligned with the transparent region of the foundation layer. The foundation layer provides an impermeable seal for the aperture at the back surface of the polishing surface layer. Methods of fabricating such polishing pads are also described.

Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer

Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.

Polishing pad with multi-modal distribution of pore diameters

Polishing pads with homogeneous bodies having discrete protrusions thereon are described. In an example, a polishing pad for polishing a substrate includes a homogeneous body having a polishing side and a back side. The homogeneous body is composed of a material having a first hardness. A plurality of discrete protrusions is disposed on and covalently bonded with the polishing side of the homogeneous body. The plurality of discrete protrusions is composed of a material having a second hardness different from the first hardness. Methods of fabricating polishing pads with homogeneous bodies having discrete protrusions thereon are also described.

Polishing pad with homogeneous body having discrete protrusions thereon

Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.

Polishing pad with alignment feature

Polishing pads having porogens with liquid filler and methods of fabricating polishing pads having porogens with liquid filler are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a polymer matrix and a plurality of porogens dispersed throughout the polymer matrix. Each of the plurality of porogens has a shell with a liquid filler. The liquid filler has a boiling point less than 100 degrees Celsius at a pressure of 1 atm, a density less than water, or both.

Polishing pad having porogens with liquid filler

Polishing pads with concentric or approximately concentric polygon groove patterns are described. Methods of fabricating polishing pads with concentric or approximately concentric polygon groove patterns are also described.

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Beaverton, OR, United States of America

William C Allison