The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2015
Filed:
Jan. 13, 2010
William Allison, Beaverton, OR (US);
Ping Huang, St. Louis Park, MN (US);
Diane Scott, Portland, OR (US);
Richard Frentzel, Murrieta, CA (US);
Robert Kerprich, Portland, OR (US);
William Allison, Beaverton, OR (US);
Ping Huang, St. Louis Park, MN (US);
Diane Scott, Portland, OR (US);
Richard Frentzel, Murrieta, CA (US);
Robert Kerprich, Portland, OR (US);
NexPlanar Corporation, Hillsboro, OR (US);
Abstract
A CMP polishing pad comprising (a) a polishing layer having a polishing surface and a back surface opposite said polishing surface; said polishing layer having at least one cured opaque thermoset polyurethane region and at least one aperture region; said at least one cured opaque thermoset region has a porosity from about 10% to about 55% by volume; said at least one aperture region having (1) a top opening positioned below the polishing surface, (2) a bottom opening that is co-planar with said back surface and (3) straight line vertical sidewalls extending from said aperture top opening to said aperture bottom opening; said at least one aperture region filled with a cured plug of thermoset polyurethane local area transparency material that has a light transmission of less than 80% at a wavelength from 700 to 710 nanometers and is chemically bonded directly to a thermoset polyurethane opaque area;