The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2023

Filed:

Jul. 08, 2020
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

Rui Ma, Aurora, IL (US);

Lin Fu, Rancho Palos Verdes, CA (US);

Chen-Chih Tsai, Naperville, IL (US);

Jaeseok Lee, Beaverton, OR (US);

Sarah Brosnan, St. Charles, IL (US);

Assignee:

CMC MATERIALS, INC., Aurora, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01);
Abstract

A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.


Find Patent Forward Citations

Ma, Rui. (2023). Polishing pad employing polyamine and cyclohexanedimethanol curatives (U.S. Patent No. 11845156). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11845156

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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