The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2025
Filed:
Sep. 02, 2022
Applicant:
Cmc Materials, Inc., Aurora, IL (US);
Inventors:
Rui Ma, Aurora, IL (US);
Kaiting Li, Portland, OR (US);
Jessica Tabert, Aurora, IL (US);
Sangcheol Kim, Chicago, IL (US);
Satish Rai, Aurora, IL (US);
Assignee:
CMC MATERIALS LLC, Aurora, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/24 (2012.01); C08L 75/04 (2006.01);
U.S. Cl.
CPC ...
B24B 37/24 (2013.01); C08L 75/04 (2013.01);
Abstract
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at a surface of the polymeric body; and a plurality of pores at the surface of the polymeric body.