The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2025

Filed:

Sep. 14, 2018
Applicant:

Cabot Microelectronics Corporation, Aurora, IL (US);

Inventors:

Kevin P. Dockery, Aurora, IL (US);

Tyler Carter, Naperville, IL (US);

Matthew E. Carnes, Chicago, IL (US);

Jessica Vankuiken, Glendale Heights, IL (US);

Pankaj Singh, Plainfield, IL (US);

Assignee:

CMC MATERIALS LLC, Aurora, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 1/00 (2006.01); B24B 37/04 (2012.01); C09G 1/00 (2006.01); C09G 1/04 (2006.01); C09G 1/06 (2006.01); C09K 13/06 (2006.01); C23F 1/30 (2006.01); C23F 3/06 (2006.01); H01L 21/306 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 1/00 (2013.01); B24B 37/044 (2013.01); C09G 1/00 (2013.01); C09G 1/04 (2013.01); C09G 1/06 (2013.01); C09K 13/06 (2013.01); C23F 1/30 (2013.01); C23F 3/06 (2013.01); H01L 21/30625 (2013.01); H01L 21/3212 (2013.01);
Abstract

A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, abrasive particles dispersed in the liquid carrier, an iron containing accelerator, and a cationic polymer having an amino acid monomer. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above-described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.


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