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Hsinchu, Taiwan

Chipmos Technologies Inc.

USPTO Granted Patents = 178

% Expired Patents = 46.1

EPO Patents = 1

Trademarks = 8

Forward Citations = 789

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116 inventors (with patents filed for the assignee):

Geng-Shin Shen (48 out of 49 patents)

An-Hong Liu (25 out of 29 patents)

Shih-Wen Chou (21 out of 25 patents)

4. Yu-Tang Pan (14 out of 16 patents)

5. Yi-Chang Lee (12 out of 12 patents)

6. Yu-Ren Chen (11 out of 15 patents)

7. Yao-Jung Lee (11 out of 15 patents)

8. Chun-Ying Lin (11 out of 12 patents)

9. David Wei Wang (11 out of 11 patents)

10. Wu-Chang Tu (10 out of 10 patents)

11. Yeong-Her Wang (10 out of 19 patents)

12. Hsiang-Ming Huang (10 out of 10 patents)

13. Yeong-Ching Chao (10 out of 10 patents)

14. Yuan-Ping Tseng (7 out of 11 patents)

15. Geng Shin Shen (6 out of 6 patents)

Core Competencies:

Chip-On-Film Package

Multi-Chip Package

Wafer Level Package

Thermal Management

Fingerprint Sensor

Re-Distribution Layer

Solder Ball

QFN Package

Conductive Structure

Stacked Chip Package

Non-Leaded Package

Electrostatic Dissipation

178 patents: Sort by Forward Citations

1. 10211142 - Chip-on-film package structure (2019-02-19),

2. 10068861 - Semiconductor device (2018-09-04),

3. 10002815 - Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process (2018-06-19),

4. 9953960 - Manufacturing process of wafer level chip package structure having block structure (2018-04-24),

5. 9865777 - Semicondcutor light-emitting device and fabricating method thereof (2018-01-09),

6. 9859239 - Re-distribution layer structure and manufacturing method thereof (2018-01-02),

7. 9847254 - Fingerprint sensor chip package structure and manufacturing method thereof (2017-12-19),

8. 9793229 - Insulating protrusion in the trench of a re-distribution layer structure (2017-10-17),

9. 9780056 - Solder ball, manufacturing method thereof, and semiconductor device (2017-10-03),

10. 9735132 - Semiconductor package (2017-08-15),

11. 9735092 - Manufacturing method of chip package structure (2017-08-15),

12. 9728479 - Multi-chip package structure, wafer level chip package structure and manufacturing process thereof (2017-08-08),

13. 9721913 - Semiconductor package and method of manufacturing thereof (2017-08-01),

14. 9653429 - Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof (2017-05-16),

15. 9620445 - Chip package structure and method of manufacturing the same (2017-04-11),

Chipmos Technologies Inc. is a leading provider of semiconductor packaging and testing services, headquartered in Hsinchu, Taiwan. The company specializes in advanced packaging solutions such as Chip-On-Film, Multi-Chip Packages, and Wafer Level Packages, catering to a diverse range of applications including consumer electronics and automotive sectors. Chipmos is recognized for its expertise in thermal management and innovative technologies like fingerprint sensors and re-distribution layers, positioning itself as a key player in the semiconductor industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

178 Patents

#44 in Hsinchu

#151 in Taiwan

#4,675 in the World

Hsinchu, Taiwan

Chipmos Technologies Inc.

Forward Citations = 789

116 inventors:

Geng-Shin Shen (48 out of 49 patents)

An-Hong Liu (25 out of 29 patents)

Shih-Wen Chou (21 out of 25 patents)

4. Yu-Tang Pan (14 out of 16 patents)

5. Yi-Chang Lee (12 out of 12 patents)

Please report any incorrect information to [email protected]

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