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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chipmos Technologies Inc.


USPTO Granted Patents = 178


Trademarks = 8

Forward Citations = 778

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118 inventors (with patents filed for the assignee):

goldMedal Geng-Shin Shen (48 out of 49 patents)

silverMedal An-Hong Liu (25 out of 29 patents)

bronzeMedal Shih-Wen Chou (21 out of 25 patents)

4.  Yu-Tang Pan (14 out of 16 patents)

5.  Yi-Chang Lee (12 out of 12 patents)

6.  Yu-Ren Chen (11 out of 15 patents)

7.  Yao-Jung Lee (11 out of 15 patents)

8.  Chun-Ying Lin (11 out of 12 patents)

9.  David Wei Wang (11 out of 11 patents)

10.  Wu-Chang Tu (10 out of 10 patents)

11.  Yeong-Her Wang (10 out of 19 patents)

12.  Hsiang-Ming Huang (10 out of 10 patents)

13.  Yeong-Ching Chao (10 out of 10 patents)

14.  Yuan-Ping Tseng (7 out of 11 patents)

15.  Geng Shin Shen (6 out of 6 patents)


Core Competencies:
Chip-On-Film Package Structure
Multi-Chip Package Structure
Wafer Level Chip Package
Fingerprint Sensor Chip Package
Thermally Enhanced Electronic Package
Quad Flat No-Lead Package
Conductive Structure
Bump Structure
Semiconductor Light-Emitting Device
Re-Distribution Layer Structure
Semiconductor Device
RFID Real-Time Information System

178 patents:

1. 10211142 - Chip-on-film package structure (2019-02-19),
2. 10068861 - Semiconductor device (2018-09-04),
3. 10002815 - Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process (2018-06-19),
4. 9953960 - Manufacturing process of wafer level chip package structure having block structure (2018-04-24),
5. 9865777 - Semicondcutor light-emitting device and fabricating method thereof (2018-01-09),
6. 9859239 - Re-distribution layer structure and manufacturing method thereof (2018-01-02),
7. 9847254 - Fingerprint sensor chip package structure and manufacturing method thereof (2017-12-19),
8. 9793229 - Insulating protrusion in the trench of a re-distribution layer structure (2017-10-17),
9. 9780056 - Solder ball, manufacturing method thereof, and semiconductor device (2017-10-03),
10. 9735132 - Semiconductor package (2017-08-15),
11. 9735092 - Manufacturing method of chip package structure (2017-08-15),
12. 9728479 - Multi-chip package structure, wafer level chip package structure and manufacturing process thereof (2017-08-08),
13. 9721913 - Semiconductor package and method of manufacturing thereof (2017-08-01),
14. 9653429 - Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof (2017-05-16),
15. 9620445 - Chip package structure and method of manufacturing the same (2017-04-11),
ChipMOS Technologies Inc. is a leading provider of semiconductor assembly and test services. With advanced technologies and a strong focus on customer satisfaction, ChipMOS offers a wide range of integrated circuits packaging and testing solutions. The company has a global presence and serves clients from various industries including consumer electronics, communication, automotive, and more.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 9 2025

178 Patents

#26 in Hsinchu

#141 in Taiwan

#4,544 in the World

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Hsinchu, Taiwan

Chipmos Technologies Inc.

Forward Citations = 778

118 inventors:

goldMedal Geng-Shin Shen (48 out of 49 patents)

silverMedal An-Hong Liu (25 out of 29 patents)

bronzeMedal Shih-Wen Chou (21 out of 25 patents)

4.  Yu-Tang Pan (14 out of 16 patents)

5.  Yi-Chang Lee (12 out of 12 patents)

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