For the Inventor, By the Inventor

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Hsinchu, Taiwan

Chipmos Technologies Inc.

USPTO Granted Patents = 178

% Expired Patents = 46.1

EPO Patents = 1

Trademarks = 8

Forward Citations = 789

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116 inventors (with patents filed for the assignee):

Geng-Shin Shen (48 out of 49 patents)

An-Hong Liu (25 out of 29 patents)

Shih-Wen Chou (21 out of 25 patents)

4. Yu-Tang Pan (14 out of 16 patents)

5. Yi-Chang Lee (12 out of 12 patents)

6. Yu-Ren Chen (11 out of 15 patents)

7. Yao-Jung Lee (11 out of 15 patents)

8. Chun-Ying Lin (11 out of 12 patents)

9. David Wei Wang (11 out of 11 patents)

10. Wu-Chang Tu (10 out of 10 patents)

11. Yeong-Her Wang (10 out of 19 patents)

12. Hsiang-Ming Huang (10 out of 10 patents)

13. Yeong-Ching Chao (10 out of 10 patents)

14. Yuan-Ping Tseng (7 out of 11 patents)

15. Geng Shin Shen (6 out of 6 patents)

Core Competencies:

Chip-On-Film Package

Multi-Chip Package

Wafer Level Package

Thermal Management

Fingerprint Sensor

Re-Distribution Layer

Solder Ball

QFN Package

Conductive Structure

Stacked Chip Package

Non-Leaded Package

Electrostatic Dissipation

178 patents: Sort by Forward Citations

1. 10211142 - Chip-on-film package structure (2019-02-19),

2. 10068861 - Semiconductor device (2018-09-04),

3. 10002815 - Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process (2018-06-19),

4. 9953960 - Manufacturing process of wafer level chip package structure having block structure (2018-04-24),

5. 9865777 - Semicondcutor light-emitting device and fabricating method thereof (2018-01-09),

6. 9859239 - Re-distribution layer structure and manufacturing method thereof (2018-01-02),

7. 9847254 - Fingerprint sensor chip package structure and manufacturing method thereof (2017-12-19),

8. 9793229 - Insulating protrusion in the trench of a re-distribution layer structure (2017-10-17),

9. 9780056 - Solder ball, manufacturing method thereof, and semiconductor device (2017-10-03),

10. 9735132 - Semiconductor package (2017-08-15),

11. 9735092 - Manufacturing method of chip package structure (2017-08-15),

12. 9728479 - Multi-chip package structure, wafer level chip package structure and manufacturing process thereof (2017-08-08),

13. 9721913 - Semiconductor package and method of manufacturing thereof (2017-08-01),

14. 9653429 - Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof (2017-05-16),

15. 9620445 - Chip package structure and method of manufacturing the same (2017-04-11),

ChipMOS Technologies Inc. is a leading provider of semiconductor assembly and test services. With advanced technologies and a strong focus on customer satisfaction, ChipMOS offers a wide range of integrated circuits packaging and testing solutions. The company has a global presence and serves clients from various industries including consumer electronics, communication, automotive, and more.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

178 Patents

#44 in Hsinchu

#151 in Taiwan

#4,673 in the World

Hsinchu, Taiwan

Chipmos Technologies Inc.

Forward Citations = 789

116 inventors:

Geng-Shin Shen (48 out of 49 patents)

An-Hong Liu (25 out of 29 patents)

Shih-Wen Chou (21 out of 25 patents)

4. Yu-Tang Pan (14 out of 16 patents)

5. Yi-Chang Lee (12 out of 12 patents)

Please report any incorrect information to [email protected]

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