Tainan County, Taiwan

Chun-Ying Lin


Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 82(Granted Patents)


Location History:

  • Tainan, TW (2010)
  • Tainan County, TW (2008 - 2011)

Company Filing History:


Years Active: 2008-2011

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12 patents (USPTO):Explore Patents

Title: Innovations of Chun-Ying Lin

Introduction

Chun-Ying Lin is a prominent inventor based in Tainan County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 12 patents. His work focuses on improving the efficiency and effectiveness of chip packages, which are essential components in modern electronics.

Latest Patents

One of his latest patents is a chip package that includes a thermal enhanced plate, contacts around the thermal enhanced plate, and a film-like circuit layer. This innovative design enhances heat dissipation efficiency for light-emitting chip packages. Another notable patent is a manufacturing process for a chip package structure, which involves bonding multiple chips onto a patterned conductive layer and encapsulating them with a molding compound. This process ensures that the chips are electrically connected while maintaining structural integrity.

Career Highlights

Chun-Ying Lin has worked with notable companies such as Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in chip packaging technology.

Collaborations

Chun-Ying Lin has collaborated with talented individuals in his field, including Geng-Shin Shen and Ya-Chi Chen. These partnerships have fostered innovation and have led to the development of cutting-edge technologies in chip packaging.

Conclusion

Chun-Ying Lin's contributions to chip packaging technology are noteworthy, and his patents reflect his commitment to innovation in the electronics industry. His work continues to influence the development of more efficient electronic components.

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