The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Sep. 06, 2006
Ya-chi Chen, Tainan County, TW;
Chun-ying Lin, Tainan County, TW;
Yu-ren Chen, Tainan County, TW;
I-hsin Mao, Tainan County, TW;
Ya-Chi Chen, Tainan County, TW;
Chun-Ying Lin, Tainan County, TW;
Yu-Ren Chen, Tainan County, TW;
I-Hsin Mao, Tainan County, TW;
ChipMOS Technologies, Inc., Hsinchu, TW;
ChipMOS Technologies (Bermuda) Ltd., Hamilton, BM;
Abstract
A chip package structure including a chip, a lead frame, first bonding wires and second bonding wires is provided. The chip has an active surface, first bonding pads and second bonding pads, wherein the first bonding pads and the second bonding pads are disposed on the active surface. The chip is fixed below the lead frame, and the lead frame includes inner leads and bus bars. The inner leads and the bus bars are disposed above the active surface of the chip, and the bus bars are located between the inner leads and the corresponding first bonding pads. The first bonding wires respectively connect the first bonding pads and the bus bars. The second bonding wires respectively connect the bus bars and a part of the inner leads. The third bonding wires respectively connect the second bonding pads and the other of the inner leads.