I-Hsin Mao

Title: I-Hsin Mao: Innovator in Chip Packaging Technology

Introduction

I-Hsin Mao is a notable inventor based in Tainan County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 4 patents. His innovative work focuses on enhancing the efficiency and functionality of chip structures.

Latest Patents

Mao's latest patents include a "Structure of Stacking Chips and Method for Manufacturing the Same." This invention provides a method for stacking a wafer with optical chips and a glass substrate with signal processing chips. The process involves ball mounting and die sawing to create a stacked packaging structure. The optical chips and signal processing chips establish electrical connections on the glass substrate through the through holes. Another significant patent is for a "Chip Package," which features a thermal enhanced plate and contacts that are electrically insulated from it. This design improves heat dissipation efficiency for light-emitting chip packages.

Career Highlights

Throughout his career, I-Hsin Mao has worked with prominent companies in the semiconductor industry, including Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to refine his expertise in chip packaging and related technologies.

Collaborations

Mao has collaborated with talented individuals such as Chun-Ying Lin and Ya-Chi Chen, contributing to advancements in their shared field of expertise.

Conclusion

I-Hsin Mao's innovative contributions to chip packaging technology demonstrate his commitment to enhancing electronic components. His patents reflect a deep understanding of the complexities involved in chip design and manufacturing.