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Hamilton, Bermuda

Chipmos Technologies (bermuda) Ltd

USPTO Granted Patents = 85

Trademarks = 8

Forward Citations = 460

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50 inventors (with patents filed for the assignee):

Geng-Shin Shen (34 out of 49 patents)

An-Hong Liu (16 out of 29 patents)

Yao-Jung Lee (10 out of 15 patents)

4. Yeong-Her Wang (10 out of 19 patents)

5. Yeong-Ching Chao (10 out of 10 patents)

6. Wu-Chang Tu (9 out of 10 patents)

7. Chun-Ying Lin (8 out of 12 patents)

8. Shih-Wen Chou (7 out of 25 patents)

9. Yu-Ren Chen (7 out of 15 patents)

10. Yi-Chang Lee (7 out of 12 patents)

11. Hsiang-Ming Huang (6 out of 10 patents)

12. Jie-Hung Chiou (5 out of 5 patents)

13. Yan-Yi Wu (5 out of 5 patents)

14. Yu-Tang Pan (5 out of 16 patents)

15. Chun-Hung Lin (5 out of 6 patents)

Core Competencies:

Chip Package Structure

Bump Structure

Stacked Chip Package

Leadframe Manufacturing

Quad Flat Non-Leaded Package

Die Rearrangement

Semiconductor Integrated Circuit

Conductive Structure

Wafer Treating Method

Film Type Package

Electronic Device Packaging

Redistribution Circuit Structure

85 patents: Sort by Forward Citations

1. 8431437 - Packaging method involving rearrangement of dice (2013-04-30),

2. 8426245 - Packaging method involving rearrangement of dice (2013-04-23),

3. 8421223 - Conductive structure for a semiconductor integrated circuit (2013-04-16),

4. 8268717 - Manufacturing method of bump structure with annular support (2012-09-18),

5. 8212347 - Stacked chip package structure with leadframe having bus bar (2012-07-03),

6. 8207603 - Stacked chip package structure with leadframe having inner leads with transfer pad (2012-06-26),

7. 8169061 - Stacked chip package structure with leadframe having bus bar (2012-05-01),

8. 8105881 - Method of fabricating chip package structure (2012-01-31),

9. 8088650 - Method of fabricating chip package (2012-01-03),

10. 8039946 - Chip package structure and fabricating method thereof (2011-10-18),

11. 8030767 - Bump structure with annular support (2011-10-04),

12. 7981725 - Fabricating process of a chip package structure (2011-07-19),

13. 7964940 - Chip package with asymmetric molding (2011-06-21),

14. 7960214 - Chip package (2011-06-14),

15. 7952198 - BGA package with leads on chip (2011-05-31),

Chipmos Technologies (Bermuda) Ltd is a semiconductor assembly and test service provider. They offer a wide range of services including wafer probing, wafer sorting, bumping, assembly, and testing. With a strong focus on quality and innovation, Chipmos Technologies strives to meet the needs of their clients in the global semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

85 Patents

#11 in Hamilton

#11 in Bermuda

#8,669 in the World

Hamilton, Bermuda

Chipmos Technologies (bermuda) Ltd

Forward Citations = 460

50 inventors:

Geng-Shin Shen (34 out of 49 patents)

An-Hong Liu (16 out of 29 patents)

Yao-Jung Lee (10 out of 15 patents)

4. Yeong-Her Wang (10 out of 19 patents)

5. Yeong-Ching Chao (10 out of 10 patents)

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