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Hamilton, Bermuda

Chipmos Technologies (Bermuda) Ltd

USPTO Granted Patents = 85

% Expired Patents = 67.1

Trademarks = 8

Forward Citations = 463

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50 inventors (with patents filed for the assignee):

Geng-Shin Shen (34 out of 49 patents)

An-Hong Liu (16 out of 29 patents)

Yao-Jung Lee (10 out of 15 patents)

4. Yeong-Her Wang (10 out of 19 patents)

5. Yeong-Ching Chao (10 out of 10 patents)

6. Wu-Chang Tu (9 out of 10 patents)

7. Chun-Ying Lin (8 out of 12 patents)

8. Shih-Wen Chou (7 out of 25 patents)

9. Yu-Ren Chen (7 out of 15 patents)

10. Yi-Chang Lee (7 out of 12 patents)

11. Hsiang-Ming Huang (6 out of 10 patents)

12. Jie-Hung Chiou (5 out of 5 patents)

13. Yan-Yi Wu (5 out of 5 patents)

14. Yu-Tang Pan (5 out of 16 patents)

15. Chun-Hung Lin (5 out of 6 patents)

Core Competencies:

Chip Packaging

Stacked Structures

Bump Fabrication

Leadframe Designs

Quad Flat Non-leaded

Die Rearrangement

High Frequency IC

Wafer Structure

Electronic Devices

Redistribution Circuit

Modular Probe Card

Image Sensor Assembly

85 patents: Sort by Forward Citations

1. 8431437 - Packaging method involving rearrangement of dice (2013-04-30),

2. 8426245 - Packaging method involving rearrangement of dice (2013-04-23),

3. 8421223 - Conductive structure for a semiconductor integrated circuit (2013-04-16),

4. 8268717 - Manufacturing method of bump structure with annular support (2012-09-18),

5. 8212347 - Stacked chip package structure with leadframe having bus bar (2012-07-03),

6. 8207603 - Stacked chip package structure with leadframe having inner leads with transfer pad (2012-06-26),

7. 8169061 - Stacked chip package structure with leadframe having bus bar (2012-05-01),

8. 8105881 - Method of fabricating chip package structure (2012-01-31),

9. 8088650 - Method of fabricating chip package (2012-01-03),

10. 8039946 - Chip package structure and fabricating method thereof (2011-10-18),

11. 8030767 - Bump structure with annular support (2011-10-04),

12. 7981725 - Fabricating process of a chip package structure (2011-07-19),

13. 7964940 - Chip package with asymmetric molding (2011-06-21),

14. 7960214 - Chip package (2011-06-14),

15. 7952198 - BGA package with leads on chip (2011-05-31),

Company Overview

Chipmos Technologies (Bermuda) Ltd specializes in advanced chip packaging solutions, focusing on innovative technologies such as stacked structures and bump fabrication. The company is recognized for its expertise in leadframe designs and quad flat non-leaded packages, catering to high-frequency integrated circuits. With a strong emphasis on wafer structure and die rearrangement, Chipmos plays a pivotal role in enhancing semiconductor performance and reliability, serving a global clientele from its headquarters in Hamilton, Bermuda.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

85 Patents

#12 in Hamilton

#12 in Bermuda

#8,958 in the World

Hamilton, Bermuda

Chipmos Technologies (Bermuda) Ltd

Forward Citations = 463

50 inventors:

Geng-Shin Shen (34 out of 49 patents)

An-Hong Liu (16 out of 29 patents)

Yao-Jung Lee (10 out of 15 patents)

4. Yeong-Her Wang (10 out of 19 patents)

5. Yeong-Ching Chao (10 out of 10 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Chipmos Technologies (Bermuda) Ltd. Retrieved from https://idiyas.com/company/chipmos-technologies-bermuda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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