Jie-Hung Chiou

Title: Innovations of Jie-Hung Chiou in Chip Packaging Technology

Introduction

Jie-Hung Chiou is a prominent inventor based in Shanghai, China, known for his significant contributions to chip packaging technology. With a total of five patents to his name, Chiou has developed innovative methods that enhance the efficiency and reliability of chip packages. His work is crucial in the ever-evolving field of electronics.

Latest Patents

Chiou's latest patents include a method of fabricating a chip package structure. This method involves providing a lead frame with a die pad, multiple leads, and at least one structure enhancement element. A chip is placed on the die pad, and bonding wires are formed to connect the chip to the leads. The process includes forming an upper encapsulant and a first lower encapsulant on the lead frame. The first lower encapsulant features concaves that expose the structure enhancement element, which is then etched to ensure electrical insulation. Another notable patent is a method of fabricating a chip package, which utilizes a thin metal plate with various protrusion parts. This method also involves bonding wires and encapsulants, culminating in an etching process that enhances the chip's functionality.

Career Highlights

Throughout his career, Jie-Hung Chiou has worked with reputable companies such as Chipmos Technologies (Bermuda) Ltd and Chipmos Technologies (Shanghai) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in chip packaging technology.

Collaborations

Chiou has collaborated with notable coworkers, including Yong-Chao Qiao and Yan-Yi Wu. Their combined expertise has fostered innovation and development in their projects.

Conclusion

Jie-Hung Chiou's contributions to chip packaging technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the electronics industry, paving the way for future advancements.