For the Inventor, By the Inventor

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Shanghai, China

Chipmos Technologies (shanghai) Ltd.

USPTO Granted Patents = 2

Forward Citations = 4

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5 inventors (with patents filed for the assignee):

Chih-Lung Huang (2 out of 2 patents)

Hua Pan (1 out of 13 patents)

Jie-Hung Chiou (1 out of 5 patents)

4. Yan-Yi Wu (1 out of 5 patents)

5. Xin-Ming Li (1 out of 1 patent)

2 patents: Sort by Forward Citations

1. 8039946 - Chip package structure and fabricating method thereof (2011-10-18),

2. 7361984 - Chip package structure (2008-04-22),

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USPTO Data Jan 1 1976 - Dec 23 2025

2 Patents

#757 in Shanghai

#9,995 in China

Shanghai, China

Chipmos Technologies (shanghai) Ltd.

Forward Citations = 4

5 inventors:

Chih-Lung Huang (2 out of 2 patents)

Hua Pan (1 out of 13 patents)

Jie-Hung Chiou (1 out of 5 patents)

4. Yan-Yi Wu (1 out of 5 patents)

5. Xin-Ming Li (1 out of 1 patent)

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