The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2008
Filed:
Aug. 30, 2006
Yan-yi Wu, Shanghai, CN;
Xin-ming LI, Shanghai, CN;
Chih-lung Huang, Shanghai, CN;
ChipMOS Technologies (Shanghai) Ltd., Shanghai, CN;
ChipMOS Technologies (Bermuda) Ltd., Hamilton, BM;
Abstract
A chip package structure including a lead frame, at least one first bonding wire, at least one second bonding wire, third bonding wires and an encapsulant is provided. The lead frame includes a die pad, inner leads and at least one bus bar, wherein the bus bar is disposed therebetween and has a down-set with a height difference from the inner leads. The inner leads are disposed around the die pad. The chip disposed on the die pad has at least one first contact and second contacts. The first bonding wire electrically connects the first contact to the bus bar. The second bonding wire electrically connects the bus bar to one of the inner leads. The third bonding wires electrically connect the other of the inner leads to the second contacts. The lead frame, the chip, the bonding wires are wrapped inside the encapsulant.