Yan-Yi Wu

Title: Yan-Yi Wu: Innovator in Chip Packaging Technology

Introduction

Yan-Yi Wu is a prominent inventor based in Shanghai, China, known for his significant contributions to chip packaging technology. With a total of five patents to his name, Wu has developed innovative methods that enhance the efficiency and effectiveness of chip packaging processes.

Latest Patents

Among his latest patents, Wu has introduced a method of fabricating a chip package structure. This method involves providing a lead frame with a die pad, multiple leads, and at least one structure enhancement element. A chip is placed on the die pad, and bonding wires are formed to connect the chip to the leads. The process includes forming an upper encapsulant and a first lower encapsulant on the lead frame, with the first lower encapsulant featuring concaves to expose the structure enhancement element. The final step involves etching the structure enhancement element using the first lower encapsulant as an etching mask.

Another notable patent by Wu is a method of fabricating a chip package. This method utilizes a thin metal plate with various protrusion parts. A chip is placed on the metal plate, and bonding wires are formed to connect the chip to the protrusion parts. The process also includes forming upper and lower encapsulants, with the lower encapsulant having recesses to expose portions of the metal plate. The thin metal plate is then etched using the lower encapsulant as an etching mask.

Career Highlights

Wu has worked with reputable companies in the semiconductor industry, including Chipmos Technologies (Bermuda) Ltd and Chipmos Technologies (Shanghai) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in chip packaging technology.

Collaborations

Throughout his career, Wu has collaborated with talented individuals such as Yong-Chao Qiao and Jie-Hung Chiou. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in the field.

Conclusion

Yan-Yi Wu is a distinguished inventor whose work in chip packaging technology has made a significant impact on the industry. His innovative methods and collaborations continue to drive advancements in this critical area of technology.