Hsiang-Ming Huang is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His innovative designs have advanced the technology of multi-chip stack packages, which are essential in modern electronics.

Latest Patents

One of Hsiang-Ming Huang's latest patents is a multi-chip stack package structure. This structure comprises a substrate with a defined chip placement area on its upper surface and multiple contacts located outside this area. A first chip is placed in the chip placement area, featuring a rear surface with several first pads on its active surface. Each of these pads has a first bump formed on it. Metal wires connect the first bumps to the contacts. Additionally, a second chip, equipped with second pads and corresponding second bumps, is mounted on the first chip, ensuring that the active surfaces of both chips face each other. The second bumps connect to the metal wires and the first bumps, creating a compact and efficient package.

Career Highlights

Hsiang-Ming Huang has worked with notable companies in the semiconductor industry, including Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in chip packaging technology.

Collaborations

Hsiang-Ming Huang has collaborated with talented individuals in his field, including An-Hong Liu and Yi-Chang Lee. These partnerships have fostered innovation and have been instrumental in the development of new technologies.

Conclusion

Hsiang-Ming Huang is a distinguished inventor whose work in multi-chip stack package structures has significantly impacted the semiconductor industry. His patents and collaborations reflect his commitment to advancing technology and innovation.

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