The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2008
Filed:
Mar. 01, 2006
Yi-chang Lee, Tainan, TW;
An-hong Liu, Tainan, TW;
Yeong-her Wang, Tainan, TW;
Yeong-ching Chao, Tainan, TW;
Hsiang-ming Huang, Tainan, TW;
Yi-Chang Lee, Tainan, TW;
An-Hong Liu, Tainan, TW;
Yeong-Her Wang, Tainan, TW;
Yeong-Ching Chao, Tainan, TW;
Hsiang-Ming Huang, Tainan, TW;
ChipMOS Technologies (Bermuda), Hamilton, BM;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.