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For the Inventor, By the Inventor

Tainan, Taiwan

An-Hong Liu

This inventor holds 29 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignees: Chipmos Technologies Inc., Chipmos Technologies (Bermuda) Ltd, Other. Active years: 2002-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: An-Hong Liu. Retrieved from https://idiyas.com/inventor/an-hong-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 29 

% Patents Active = 51.7

Average Co-Inventor Count = 4.1

ph-index = 9

Forward Citations = 314(Granted Patents)


Location History:

  • Tainan, CN (2005)
  • Tainan, TW (2002 - 2010)
  • Hsinchu, TW (2011 - 2013)

Company Filing History:

goldMedal25 out of 178 
 
Chipmos Technologies Inc.
 patents
silverMedal16 out of 85 
 
Chipmos Technologies (Bermuda) Ltd
 patents
bronzeMedal4 out of 834,601 
Other
 patents
where one patent can have more than one assignee

Years Active: 2002-2013

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Areas of Expertise:
RFID Systems
Multi-Chip Stacking
Semiconductor Packaging
Image Sensor Assembly
Probe Card Assembly
High Frequency IC
Elastic Probes
Wafer Level Packaging
Modular Probe Cards
Bondability
Flip-Chip Devices
29 patents (USPTO):Explore Patents
1. 8550345 - RFID real-time information system accommodated to semiconductor supply chain (2013-10-08),
2. 8269352 - Multi-chip stack package structure (2012-09-18),
3. 8269351 - Multi-chip stack package structure (2012-09-18),
4. 8264068 - Multi-chip stack package structure (2012-09-11),
5. 7973310 - Semiconductor package structure and method for manufacturing the same (2011-07-05),
6. 7696443 - Electronic device with a warped spring connector (2010-04-13),
7. 7642639 - COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same (2010-01-05),
8. 7554197 - High frequency IC package and method for fabricating the same (2009-06-30),
9. 7477065 - Method for fabricating a plurality of elastic probes in a row (2009-01-13),
10. 7420267 - Image sensor assembly and method for fabricating the same (2008-09-02),
11. 7372286 - Modular probe card (2008-05-13),
12. 7372135 - Multi-chip image sensor module (2008-05-13),
13. 7370416 - Method of manufacturing an injector plate (2008-05-13),
14. 7368809 - Pillar grid array package (2008-05-06),
15. 7316065 - Method for fabricating a plurality of elastic probes in a row (2008-01-08),

Title: An-Hong Liu: Innovator from Tainan

Introduction: An-Hong Liu is a distinguished inventor hailing from Tainan, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: An-Hong Liu's recent patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, An-Hong Liu has worked with leading research institutions and universities to pioneer new technologies in the renewable energy sector. His innovative solutions have garnered international recognition and numerous awards.

Collaborations: An-Hong Liu has collaborated with top companies in the renewable energy industry, forging partnerships that have led to the successful commercialization of his inventions. His collaborative spirit and dedication to sustainable technology have made him a respected figure in the field.

Conclusion: An-Hong Liu's passion for innovation and commitment to creating a more sustainable future through his inventions make him a true pioneer in the world of technology. His work continues to inspire and drive progress in the renewable energy sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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