The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Apr. 10, 2006
Hsiang-ming Huang, Tainan, TW;
An-hong Liu, Tainan, TW;
Yeong-jyh Lin, Tainan, TW;
Yi-chang Lee, Tainan, TW;
Wu-chang Tu, Tainan, TW;
Chun-hung Lin, Tainan, TW;
Shih Feng Chiu, Tainan, TW;
Hsiang-Ming Huang, Tainan, TW;
An-Hong Liu, Tainan, TW;
Yeong-Jyh Lin, Tainan, TW;
Yi-Chang Lee, Tainan, TW;
Wu-Chang Tu, Tainan, TW;
Chun-Hung Lin, Tainan, TW;
Shih Feng Chiu, Tainan, TW;
ChipMOS Technologies (Bermuda) Ltd, Hamilton, BM;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A high frequency IC package mainly includes a substrate, a bumped chip, and a plurality of conductive fillers where the substrate has a plurality of bump holes penetrating from the top surface to the bottom surface. The active surface of the chip is attached to the top surface of the substrate in a manner that the bumps are inserted into the bump holes respectively. The conductive fillers are formed in the bump holes to electrically connect the bumps to the circuit layer of the substrate. The high frequency IC package has a shorter electrical path and a thinner package thickness.