Tainan, Taiwan

Chun-Hung Lin

This inventor holds 6 USPTO granted patents. Top assignees: Chipmos Technologies (Bermuda) Ltd, Chipmos Technologies Inc., National Cheng-Kung University. Active years: 2008-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Hung Lin. Retrieved from https://idiyas.com/inventor/chun-hung-lin-1qtfo0xo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 16.7

Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 15(Granted Patents)


Location History:

  • Tainan County, TW (2008 - 2009)
  • Tainan, TW (2009 - 2017)

Company Filing History:


Years Active: 2008-2017

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6 patents (USPTO):Explore Patents

Title: Innovations of Chun-Hung Lin

Introduction

Chun-Hung Lin is a notable inventor based in Tainan County, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced sensing systems and adhesive die manufacturing methods. With a total of six patents to his name, Lin's work showcases his innovative spirit and technical expertise.

Latest Patents

One of Lin's latest patents is a method for a localized surface plasmon resonance (LSPR) sensing system. This system includes an optical detection mechanism and a test specimen featuring metal nanoparticles arranged in an anisotropic periodic manner. The method involves emitting incident light toward the test specimen to excite the metal nanoparticles, generating emergent light. The optical detection system then detects the phases of the emergent light's first and second polarization states, allowing for the determination of a phase difference spectrum. This innovation has potential applications in various sensing technologies.

Another significant patent by Lin is a wafer treating method for making adhesive dies. This method involves coating a liquid adhesive with two-stage properties on a wafer's surface. The wafer is pre-cured to transform the adhesive into a thermo-bonding adhesive film, which can be handled without adhesive at room temperature. After positioning, the wafer is singulated to create multiple dies suitable for die-to-die stacking, die-to-substrate, or die-to-leadframe attaching. This method enhances the efficiency of adhesive die production.

Career Highlights

Chun-Hung Lin has worked with prominent companies in the technology sector, including Chipmos Technologies Ltd and Chipmos Technologies Inc. His experience in these organizations has contributed to his development as an inventor and innovator in the field.

Collaborations

Lin has collaborated with notable colleagues such as Shih-Wen Chou and Yu-Tang Pan. These partnerships have likely fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Chun-Hung Lin's contributions to technology through his patents and career achievements highlight his role as a significant inventor. His work in localized surface plasmon resonance sensing systems and adhesive die manufacturing methods demonstrates his commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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