The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2011
Filed:
Mar. 06, 2006
Chun-hung Lin, Tainan, TW;
Jesse Huang, Kaohsiung, TW;
Kuang-hui Chen, Kaohsiung, TW;
Shih-wen Chou, Tainan, TW;
Chun-Hung Lin, Tainan, TW;
Jesse Huang, Kaohsiung, TW;
Kuang-Hui Chen, Kaohsiung, TW;
Shih-Wen Chou, Tainan, TW;
ChipMOS Technologies (Bermuda), Hamilton, BM;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A wafer treating method for making adhesive dies is provided. A liquid adhesive with two-stage property is coated on a surface of a wafer. Then, the wafer is pre-cured to make the liquid adhesive transform a thermo-bonding adhesive film having B-stage property which has a glass transition temperature not less than 40° C. for handling without adhesive under room temperature. After positioning the wafer, the wafer is singulated to form a plurality of dies with adhesive for die-to-die stacking, die-to-substrate or die-to-leadframe attaching.