IDiyas

For the Inventor, By the Inventor

Hsinchu, Taiwan

Shih-Wen Chou

USPTO Granted Patents = 25 

Average Co-Inventor Count = 1.8

ph-index = 5

Forward Citations = 96(Granted Patents)


Location History:

  • Tainan, TW (2004 - 2011)
  • Tainan County, TW (2008 - 2011)
  • Sinshih Township, Tainan County, TW (2011)
  • Hsinchu, TW (2012 - 2020)

Company Filing History:

goldMedal21 out of 178 
 
Chipmos Technologies Inc.
 patents
silverMedal7 out of 85 
 
Chipmos Technologies (bermuda) Ltd
 patents
bronzeMedal2 out of 2 
 
Chipmos Technology Inc.
 patents
4. 1 out of 507 
 
Nuvoton Technology Corporation
 patents
5. 1 out of 832,680 
Other
 patents
where one patent can have more than one assignee

Years Active: 2004-2020

Loading Chart...
25 patents (USPTO):
1. 10665277 - Timing calibration system and a method thereof (2020-05-26),
2. 10002815 - Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process (2018-06-19),
3. 9953960 - Manufacturing process of wafer level chip package structure having block structure (2018-04-24),
4. 9735092 - Manufacturing method of chip package structure (2017-08-15),
5. 9728479 - Multi-chip package structure, wafer level chip package structure and manufacturing process thereof (2017-08-08),
6. 9653429 - Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof (2017-05-16),
7. 9437529 - Chip package structure and manufacturing method thereof (2016-09-06),
8. 9053968 - Semiconductor package structure and manufacturing method thereof (2015-06-09),
9. 8772089 - Chip package structure and manufacturing method thereof (2014-07-08),
10. 8691630 - Semiconductor package structure and manufacturing method thereof (2014-04-08),
11. 8309401 - Method of manufacturing non-leaded package structure (2012-11-13),
12. 8148827 - Quad flat no lead (QFN) package (2012-04-03),
13. RE42349 - Wafer treating method for making adhesive dies (2011-05-09),
14. 7919874 - Chip package without core and stacked chip package structure (2011-04-05),
15. 7884486 - Chip-stacked package structure and method for manufacturing the same (2011-02-08),

Title: The Innovative Journey of Inventor Shih-Wen Chou

Introduction: Shih-Wen Chou, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with her groundbreaking innovations.

Latest Patents: Shih-Wen Chou's latest patents focus on advancements in renewable energy technologies, particularly in the development of solar power systems that are more efficient and cost-effective.

Career Highlights: With a career spanning over two decades, Shih-Wen Chou has established herself as a leading figure in the tech industry, holding multiple patents in various areas such as clean energy, semiconductor technology, and telecommunications.

Collaborations: Throughout her career, Shih-Wen Chou has collaborated with top research institutions, leading companies, and universities to further her research and bring her inventions to life. Her collaborative efforts have led to the successful implementation of several cutting-edge technologies in the market.

Conclusion: Shih-Wen Chou's dedication to innovation and her relentless pursuit of technological advancement have solidified her position as a respected inventor in the global tech community. Her work continues to inspire future generations of inventors to push the boundaries of what is possible in the world of technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…