The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Oct. 09, 2012
Chipmos Technologies Inc., Hsinchu, TW;
Yu-Tang Pan, Hsinchu, TW;
Shih-Wen Chou, Hsinchu, TW;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A method of manufacturing a semiconductor package structure is provided. A heat-conductive block is adhered to a portion of a second surface of a conductive substrate via a first adhesive layer. An opening is formed by performing a half-etching process on a first surface of the conductive substrate. The remaining conductive substrate is patterned to form leads and expose a portion of the heat-conductive block. Each lead has a first portion and a second portion. A thickness of the first portion is greater than a thickness of the second portion. A first lower surface of the first portion and a second lower surface of the second portion are coplanar. A chip is disposed on the exposed portion of the heat-conductive block and electrically connected to the second portions of the leads. A first bottom surface of the heat-conductive block and a second bottom surface of a molding compound are coplanar.