The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2011
Filed:
Apr. 08, 2010
Yu-tang Pan, Tainan County, TW;
Cheng-ting Wu, Tainan County, TW;
Shih-wen Chou, Tainan County, TW;
Hui-ping Liu, Tainan County, TW;
Yu-Tang Pan, Tainan County, TW;
Cheng-Ting Wu, Tainan County, TW;
Shih-Wen Chou, Tainan County, TW;
Hui-Ping Liu, Tainan County, TW;
ChipMOS Technologies, Hsinchu, TW;
ChipMOS Technologies (Bermuda) Ltd., Hamilton, BM;
Abstract
A chip package including a base, a chip, a molding compound and a plurality of outer terminals is provided. The base is essentially consisted of a patterned circuit layer having a first surface and a second surface opposite to each other and a solder mask disposed on the second surface, wherein the solder mask has a plurality of first openings by which part of the patterned circuit layer is exposed. The chip is disposed on the first surface and is electrically connected to the patterned circuit layer. The molding compound covers the pattern circuit layer and fixes the chip onto the patterned circuit layer. The outer terminals are disposed in the first openings and electrically connected to the patterned circuit layer.