Cheng-Ting Wu

Title: Cheng-Ting Wu: Innovator in Chip Packaging Technology

Introduction

Cheng-Ting Wu is a prominent inventor based in Tainan County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 5 patents. His innovative designs have advanced the efficiency and functionality of chip packaging, making him a notable figure in the industry.

Latest Patents

Wu's latest patents include a chip package structure that features a first substrate, a second substrate, and multiple chips. One of the chips is connected to the first substrate and electrically linked through a via hole. This design allows the second substrate to remain intact, facilitating the placement of conductive balls across its surface. Another notable patent is for a chip package without a core, which includes a base, a chip, a molding compound, and several outer terminals. The base consists of a patterned circuit layer with a solder mask that has openings for exposing parts of the circuit layer. The chip is mounted on the first surface and is electrically connected to the patterned circuit layer, while the molding compound secures the chip in place.

Career Highlights

Cheng-Ting Wu has worked with reputable companies such as Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in chip packaging.

Collaborations

Throughout his career, Wu has collaborated with talented individuals, including Yu-Tang Pan and Shih-Wen Chou. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Cheng-Ting Wu's contributions to chip packaging technology have established him as a leading inventor in the field. His innovative patents and collaborations reflect his commitment to advancing technology and improving the efficiency of chip packaging solutions.