The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2011
Filed:
Nov. 12, 2008
Cheng-ting Wu, Hsinchu, TW;
I-cheng LU, Hsinchu, TW;
Yu-cheng Chang, Hsinchu, TW;
Tsu-ting Wang, Hsinchu, TW;
Cheng-Ting Wu, Hsinchu, TW;
I-Cheng Lu, Hsinchu, TW;
Yu-Cheng Chang, Hsinchu, TW;
Tsu-Ting Wang, Hsinchu, TW;
Chipmos Technologies Inc., Hsinchu, TW;
Abstract
A chip package structure is provided. The chip package structure comprises a first substrate, a second substrate and a plurality of chips. Therein, one of the chips is connected to the first substrate and electrically connected to the first substrate through a via hole of the first substrate. Thereby, the second substrate does not need the via hole for electrical connection of chips and thus, the surface thereof is adapted to remain intact to allow for the disposition of conductive balls throughout the surface.