I-Cheng Lu

Title: I-Cheng Lu: Innovator in Chip Package Structures

Introduction

I-Cheng Lu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and structures. His work has been instrumental in advancing the technology used in chip packaging.

Latest Patents

I-Cheng Lu holds a patent for a chip package structure. This innovative design comprises a first substrate, a second substrate, and a plurality of chips. One of the chips is connected to the first substrate and is electrically connected through a via hole of the first substrate. This design allows the second substrate to remain intact, eliminating the need for a via hole for electrical connections, which facilitates the disposition of conductive balls throughout the surface.

Career Highlights

I-Cheng Lu is associated with Chipmos Technologies Inc., a company known for its expertise in semiconductor packaging and testing services. His work at Chipmos has allowed him to contribute to various advancements in chip packaging technology.

Collaborations

I-Cheng Lu has collaborated with notable colleagues, including Cheng-Ting Wu and Yu-Cheng Chang. These collaborations have fostered innovation and development in their respective fields.

Conclusion

I-Cheng Lu's contributions to chip package structures exemplify his commitment to innovation in semiconductor technology. His patent and work at Chipmos Technologies Inc. highlight his role as a key player in advancing the industry.