This inventor holds 1 USPTO granted patent. Top assignee: Chipmos Technologies Inc.. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: Tsu-Ting Wang: Innovator in Chip Package Structures
Introduction
Tsu-Ting Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative designs and structures. His work has been instrumental in advancing technology in this area.
Latest Patents
Tsu-Ting Wang holds a patent for a chip package structure. This innovative design comprises a first substrate, a second substrate, and a plurality of chips. One of the chips is connected to the first substrate and is electrically connected through a via hole of the first substrate. This design allows the second substrate to remain intact, eliminating the need for a via hole for electrical connections, which facilitates the disposition of conductive balls throughout the surface.
Career Highlights
Tsu-Ting Wang is currently employed at Chipmos Technologies Inc., where he continues to develop and refine his innovative ideas. His work has garnered attention in the semiconductor industry, showcasing his expertise and commitment to advancing technology.
Collaborations
Some of Tsu-Ting Wang's coworkers include Cheng-Ting Wu and I-Cheng Lu. Their collaborative efforts contribute to the innovative environment at Chipmos Technologies Inc.
Conclusion
Tsu-Ting Wang is a prominent figure in the field of chip package structures, with a patent that reflects his innovative approach to semiconductor technology. His contributions continue to influence the industry and pave the way for future advancements.