The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Dec. 13, 2005
Yu-tang Pan, Tainan County, TW;
Cheng-ting Wu, Tainan County, TW;
Shih-wen Chou, Tainan County, TW;
Hui-ping Liu, Tainan County, TW;
Yu-Tang Pan, Tainan County, TW;
Cheng-Ting Wu, Tainan County, TW;
Shih-Wen Chou, Tainan County, TW;
Hui-Ping Liu, Tainan County, TW;
ChipMOS Technologies Inc., Hsinchu, TW;
ChipMOS Technologies (Bermuda) Ltd., Hamilton, BM;
Abstract
A chip package without a core, including a patterned circuit layer, a chip, a solder mask, a molding compound and multiple outer terminals, is provided. The patterned circuit layer has a first surface and a second surface opposite to each other. The chip disposed on the first surface is electrically connected to the patterned circuit layer. The solder mask disposed on the second surface has a plurality of first openings by which part of the patterned circuit layer is exposed. The molding compound with a plurality of through holes cover the pattern circuit layer and fix the chip onto the patterned circuit layer. Each outer terminal disposed in the through hole is electrically connected to the patterned circuit layer.