Company Filing History:
3 out of 178 
3 out of 85 Years Active: 2008-2011
Title: Hui-Ping Liu: Innovator in Chip Packaging Technology
Introduction
Hui-Ping Liu is a notable inventor based in Tainan County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 3 patents. His innovative designs have advanced the efficiency and functionality of chip packages in the electronics industry.
Latest Patents
Hui-Ping Liu's latest patents include a chip package without a core and a stacked chip package structure. This innovative chip package comprises a base, a chip, a molding compound, and a plurality of outer terminals. The base consists of a patterned circuit layer with a first surface and a second surface, along with a solder mask on the second surface. The solder mask features several first openings that expose parts of the patterned circuit layer. The chip is placed on the first surface and is electrically connected to the patterned circuit layer. The molding compound encapsulates the patterned circuit layer, securing the chip in place. The outer terminals are positioned in the first openings and are electrically connected to the patterned circuit layer, enhancing the overall design and functionality of the chip package.
Career Highlights
Throughout his career, Hui-Ping Liu has worked with prominent companies in the semiconductor industry, including Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in chip packaging.
Collaborations
Hui-Ping Liu has collaborated with talented individuals in his field, including Yu-Tang Pan and Cheng-Ting Wu. These partnerships have fostered innovation and have led to the development of cutting-edge technologies in chip packaging.
Conclusion
Hui-Ping Liu's contributions to chip packaging technology have made a significant impact on the electronics industry. His innovative patents and collaborations with industry professionals highlight his dedication to advancing technology. His work continues to influence the future of chip packaging solutions.