Jesse Huang

Title: Innovations by Inventor Jesse Huang

Introduction

Jesse Huang is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on improving the efficiency and effectiveness of chip bonding processes.

Latest Patents

One of his latest patents is a "Wafer treating method for making adhesive dies." This method involves coating a wafer's surface with a liquid adhesive that has a two-stage property. The wafer is then pre-cured, transforming the adhesive into a thermo-bonding film that can be handled without adhesive at room temperature. This innovation allows for the singulation of the wafer into multiple dies, facilitating die-to-die stacking and attaching processes.

Another significant patent is for "Integrated circuit packaging for improving effective chip-bonding area." This process involves forming an A-stage liquid paste on a substrate, which is partially cured to create a B-stage film layer. The B-stage film layer is maintained without full curing during the chip-attaching and electrically connecting steps. The molding step applies a packing pressure that exceeds the chip-attaching pressure, ensuring the B-stage film layer is closely compressed to enhance the effective chip-bonding area.

Career Highlights

Jesse Huang has worked with Chipmos Technologies (Bermuda) Ltd., where he has applied his expertise in semiconductor technologies. His innovative approaches have contributed to advancements in the industry.

Collaborations

Jesse has collaborated with notable colleagues, including Chung-Hung Lin and Kuang-Hui Chen, who have supported his innovative endeavors.

Conclusion

Jesse Huang's contributions to semiconductor packaging through his patents demonstrate his commitment to innovation in the field. His work continues to influence the efficiency of chip bonding processes, showcasing the importance of inventive solutions in technology.