The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2005
Filed:
Nov. 26, 2003
Chung-hung Lin, Tainan, TW;
Cho-liang Chung, Fengshan, TW;
Ming-liang Huang, Kaohsiung, TW;
Jesse Huang, Kaohsiung, TW;
Chung-Hung Lin, Tainan, TW;
Cho-Liang Chung, Fengshan, TW;
Ming-Liang Huang, Kaohsiung, TW;
Jesse Huang, Kaohsiung, TW;
ChipMOS Technologies (Bermnuda) Ltd., Hamilton, BM;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A packaging process for improving effective chip-bonding area is disclosed in the present invention. An A-stage liquid paste is formed on a substrate and partially cured to become a B-stage film layer. The B-stage film layer is maintained without fully cured passing through a chip-attaching step and an electrically connecting step. During the molding step, the packing pressure for the molding compound (1000 psi˜1500 psi) is larger than the chip attaching pressure for enabling the B-stage film layer to be closely compressed in order to improve effective chip-bonding area. The B-stage film layer and the molding compound are cured simultaneous in the molding step.