The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2009
Filed:
Jan. 05, 2006
Yu-tang Pan, Tainan County, TW;
Geng-shin Shen, Tainan County, TW;
Chun-hung Lin, Tainan County, TW;
Yu-Tang Pan, Tainan County, TW;
Geng-Shin Shen, Tainan County, TW;
Chun-Hung Lin, Tainan County, TW;
ChipMOS Technologies Inc., Hsinchu, TW;
ChipMOS Technologies (Bermuda) Ltd., Hamilton, BM;
Abstract
A manufacturing process for chip package without core is disclosed. First of all, a conductive layer with a first surface and a second surface is provided. A first film is formed onto the first surface, and the conductive layer is patterned to form a patterned circuit layer. A solder resistance layer is formed on the patterned circuit layer and then patterned to expose parts of the patterned circuit layer. After a second film is formed on the solder resistance layer and the first film is removed, a chip is disposed on the first surface and electrically connected to the patterned circuit layer. A molding compound is formed to cover the patterned circuit layer and fix the chip onto the patterned circuit layer. After that, the second film is removed.