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Hsinchu, Taiwan

Geng-Shin Shen

USPTO Granted Patents = 49 (Patent Applications = 5)

Average Co-Inventor Count = 1.7

ph-index = 6

Forward Citations = 171(Granted Patents)

Location History:

Tainan Science-Based Industrial Park, TW (2009)
Tainan County, TW (2008 - 2011)
Tainan, TW (2010 - 2013)
Hsinchu, TW (2009 - 2015)

Company Filing History:

Chipmos Technologies Inc.

Chipmos Technologies (bermuda) Ltd

Chipmos Technology Inc.

Gainia Intellectual Asset Services, Inc.

where one patent can have more than one assignee

Years Active: 2008-2015

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Areas of Expertise:

Conductive Structure

QFN Package

Chip Package Structure

Stacked Chip Packaging

Semiconductor Structure

Creative Proposal Generation

Manufacturing Process

Die Rearrangement

Asymmetric Molding

Heat Sink Structure

Multi-Chip Stacked Package

Solder Cap Bump

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9159685 - Conductive structure and method for forming the same (2015-10-13),

2. 8962395 - QFN package and manufacturing process thereof (2015-02-24),

3. 8872336 - Conductive structure and method for forming the same (2014-10-28),

4. 8809088 - Structure of stacking chips and method for manufacturing the same (2014-08-19),

5. 8786082 - Semiconductor structure having no adjacent bumps between two adjacent pads (2014-07-22),

6. 8736060 - Packaging structure (2014-05-27),

7. 8712932 - Computer implemented apparatus for generating and filtering creative proposal (2014-04-29),

8. 8431478 - Solder cap bump in semiconductor package and method of manufacturing the same (2013-04-30),

9. 8431437 - Packaging method involving rearrangement of dice (2013-04-30),

10. 8426255 - Chip package structure and method for manufacturing the same (2013-04-23),

11. 8426245 - Packaging method involving rearrangement of dice (2013-04-23),

12. 8245193 - Automatic creative proposal generating and filtering system and manufacturing method thereof and multiple components combining method (2012-08-14),

13. 8212347 - Stacked chip package structure with leadframe having bus bar (2012-07-03),

14. 8207603 - Stacked chip package structure with leadframe having inner leads with transfer pad (2012-06-26),

15. 8169061 - Stacked chip package structure with leadframe having bus bar (2012-05-01),

Title: Geng-Shin Shen: Pioneering Taiwanese Inventor

Introduction: Geng-Shin Shen is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Geng-Shin Shen holds several patents in the areas of semiconductor technology, renewable energy, and telecommunications, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Geng-Shin Shen has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Geng-Shin Shen has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Geng-Shin Shen's passion for innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.

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