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For the Inventor, By the Inventor

Hsinchu, Taiwan

Geng-Shin Shen

This inventor holds 49 USPTO granted patents and 5 published patent applications, primarily in Chip Packaging. Top assignees: Chipmos Technologies Inc., Chipmos Technologies (Bermuda) Ltd, Chipmos Technology Inc.. Active years: 2008-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Geng-Shin Shen. Retrieved from https://idiyas.com/inventor/geng-shin-shen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 49 

% Patents Active = 40.8

Average Co-Inventor Count = 1.7

ph-index = 6

Forward Citations = 172(Granted Patents)


Location History:

  • Tainan Science-Based Industrial Park, TW (2009)
  • Tainan County, TW (2008 - 2011)
  • Tainan, TW (2010 - 2013)
  • Hsinchu, TW (2009 - 2015)

Company Filing History:

goldMedal48 out of 178 
 
Chipmos Technologies Inc.
 patents
silverMedal34 out of 85 
 
Chipmos Technologies (Bermuda) Ltd
 patents
bronzeMedal1 out of 2 
 
Chipmos Technology Inc.
 patents
4. 1 out of 2 
 
Gainia Intellectual Asset Services, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2008-2015

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Areas of Expertise:
Chip Packaging
Stacked Structures
QFN Package
Manufacturing Process
Solder Cap Bump
Die Rearrangement
Asymmetric Molding
Compliant Configuration
Thermal Management
Semiconductor Structure
49 patents (USPTO):Explore Patents
1. 9159685 - Conductive structure and method for forming the same (2015-10-13),
2. 8962395 - QFN package and manufacturing process thereof (2015-02-24),
3. 8872336 - Conductive structure and method for forming the same (2014-10-28),
4. 8809088 - Structure of stacking chips and method for manufacturing the same (2014-08-19),
5. 8786082 - Semiconductor structure having no adjacent bumps between two adjacent pads (2014-07-22),
6. 8736060 - Packaging structure (2014-05-27),
7. 8712932 - Computer implemented apparatus for generating and filtering creative proposal (2014-04-29),
8. 8431478 - Solder cap bump in semiconductor package and method of manufacturing the same (2013-04-30),
9. 8431437 - Packaging method involving rearrangement of dice (2013-04-30),
10. 8426255 - Chip package structure and method for manufacturing the same (2013-04-23),
11. 8426245 - Packaging method involving rearrangement of dice (2013-04-23),
12. 8245193 - Automatic creative proposal generating and filtering system and manufacturing method thereof and multiple components combining method (2012-08-14),
13. 8212347 - Stacked chip package structure with leadframe having bus bar (2012-07-03),
14. 8207603 - Stacked chip package structure with leadframe having inner leads with transfer pad (2012-06-26),
15. 8169061 - Stacked chip package structure with leadframe having bus bar (2012-05-01),

Title: Geng-Shin Shen: Pioneering Taiwanese Inventor

Introduction: Geng-Shin Shen is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Geng-Shin Shen holds several patents in the areas of semiconductor technology, renewable energy, and telecommunications, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Geng-Shin Shen has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Geng-Shin Shen has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous successful projects and inventions.

Conclusion: Geng-Shin Shen's passion for innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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