Location History:
- Tainan County, TW (2009 - 2010)
- Tainan, TW (2009 - 2010)
- Hsinchu, TW (2009 - 2012)
Company Filing History:
10 out of 178 
9 out of 85 Years Active: 2009-2012
Title: Innovations of Wu-Chang Tu
Introduction
Wu-Chang Tu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on innovative chip-stacked package structures that enhance the performance and efficiency of electronic devices.
Latest Patents
One of his latest patents is the "Stacked chip package structure with leadframe having bus bar." This invention provides a chip-stacked package structure that includes a leadframe composed of multiple inner leads arranged in rows facing each other, along with a die pad positioned between the inner leads. The design allows for a chip-stacked structure formed with several chips that are electrically connected to the inner leads. An encapsulant covers the entire structure, ensuring durability and reliability.
Another notable patent is the "Stacked chip package structure with leadframe having inner leads with transfer pad." This invention features a leadframe with inner leads arranged in rows and a die pad that is vertically distant from these leads. The offset chip-stacked structure is set on the die pad and is electrically connected to the inner leads. The inner leads are coated with an insulating layer, enhancing their functionality and performance.
Career Highlights
Wu-Chang Tu has worked with notable companies in the semiconductor industry, including Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in chip packaging technology.
Collaborations
Some of his coworkers include Geng-Shin Shen and Hsiang-Ming Huang. Their collaboration has contributed to the advancement of semiconductor technologies and innovations.
Conclusion
Wu-Chang Tu's contributions to the field of semiconductor packaging through his patents and career achievements highlight his role as a leading inventor. His innovative designs continue to influence the industry and pave the way for future advancements in technology.