The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2008
Filed:
Sep. 19, 2005
Hsiang-ming Huang, Tainan, TW;
Yeong-ching Chao, Tainan, TW;
Yi-chang Lee, Tainan, TW;
An-hong Liu, Tainan, TW;
Hsiang-Ming Huang, Tainan, TW;
Yeong-Ching Chao, Tainan, TW;
Yi-Chang Lee, Tainan, TW;
An-Hong Liu, Tainan, TW;
ChipMOS Technologies (Bermuda) Ltd., Hamilton HM 12, BM;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A pillar grid array package (PGA) includes a substrate, a chip disposed on top of the substrate, and a plurality of stud bumps disposed on bottom of the substrate. The stud bumps are formed in an array and each has a flattened top to electrically connect to a printed circuit board, PCB, by an anisotropic conductive paste to achieve a thin package and to avoid substrate warpage problems of a ball grid array (BGA) during high-temperature reflow processes.