The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
May. 15, 2008
Cheng-fang Huang, Hsinchu, TW;
Pin-hsun Huang, Hsinchu, TW;
Chih-hsiang Wang, Hsinchu, TW;
Wen-cheng Hsu, Hsinchu, TW;
Yi-fang Cho, Hsinchu, TW;
An-hong Liu, Hsinchu, TW;
Yi-chang Lee, Hsinchu, TW;
Cheng-Fang Huang, Hsinchu, TW;
Pin-Hsun Huang, Hsinchu, TW;
Chih-Hsiang Wang, Hsinchu, TW;
Wen-Cheng Hsu, Hsinchu, TW;
Yi-fang cho, Hsinchu, TW;
An-Hong Liu, Hsinchu, TW;
Yi-Chang Lee, Hsinchu, TW;
Chipmos Technologies Inc., Hsinchu, TW;
Abstract
This invention provides an RFID real-time information system accommodated to a semiconductor supply chain for exchanging real-time information. The RFID real-time information system is characterized by comprising an RFID middleware module for generating a stock and logistic information corresponding to a plurality of carriers and wafers from a tag information; a manufacturing information module for storing an object information corresponding to the plurality of wafers; a real-time information module for integrating the RFID middleware module with the manufacturing information module to generate real-time information corresponding to the plurality of wafers and carriers; and a business-to-business (B2B) e-commerce module comprising a plurality of B2B servers respectively disposed in vendors in the semiconductor supply chain for connecting and exchanging the real-time information through a standard protocol of e-commerce.