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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yu-Ren Chen

USPTO Granted Patents = 15

Average Co-Inventor Count = 2.2

ph-index = 5

Forward Citations = 133(Granted Patents)


Location History:

  • Tainan County, TW (2008 - 2011)
  • Hsinchu, TW (2008 - 2013)

Company Filing History:

goldMedal11 out of 178 
 
Chipmos Technologies Inc.
 patents
silverMedal7 out of 85 
 
Chipmos Technologies (bermuda) Ltd
 patents
bronzeMedal4 out of 76 
 
Holtek Semiconductor Corp.
 patents
where one patent can have more than one assignee

Years Active: 2008-2013

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15 patents (USPTO):Explore Patents
1. 8431437 - Packaging method involving rearrangement of dice (2013-04-30),
2. 8426245 - Packaging method involving rearrangement of dice (2013-04-23),
3. 7932531 - Chip package (2011-04-26),
4. 7927922 - Dice rearrangement package structure using layout process to form a compliant configuration (2011-04-19),
5. 7919358 - Method for fabricating multi-chip stacked package (2011-04-05),
6. 7888783 - Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers (2011-02-15),
7. 7816957 - Power on reset generating circuit and method thereof (2010-10-19),
8. 7781878 - Zigzag-stacked package structure (2010-08-24),
9. 7700412 - Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers (2010-04-20),
10. 7663425 - Fuse option circuit (2010-02-16),
11. 7663246 - Stacked chip packaging with heat sink structure (2010-02-16),
12. 7642137 - Manufacturing method of chip package (2010-01-05),
13. 7532058 - Fuse option circuit (2009-05-12),
14. 7446400 - Chip package structure and fabricating method thereof (2008-11-04),
15. 7348817 - Circuit and method for generating circuit power on reset signal (2008-03-25),

Title: Innovations of Yu-Ren Chen

Introduction

Yu-Ren Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of technology, particularly in packaging methods for semiconductor devices. With a total of 15 patents to his name, Chen's work has had a considerable impact on the industry.

Latest Patents

One of Yu-Ren Chen's latest patents is a packaging method involving the rearrangement of dice. This innovative method includes attaching a plurality of dice, each equipped with bonding pads on an active surface, to an adhesive layer on a substrate. A polymer material is then formed over both the substrate and the dice. A molding apparatus is utilized to ensure that the polymer material fills around the dice effectively. After the molding apparatus is removed, the surface of the polymer material is exposed, and cutting streets are formed on this surface. Finally, the substrate is removed to reveal the active surfaces of the dice.

Career Highlights

Throughout his career, Yu-Ren Chen has worked with notable companies such as Chipmos Technologies Inc. and Chipmos Technologies (Bermuda) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Yu-Ren Chen has collaborated with talented individuals in his field, including Geng-Shin Shen and Chun-Ying Lin. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Yu-Ren Chen's contributions to the field of technology, particularly in packaging methods, demonstrate his innovative spirit and dedication to advancing the industry. His patents and collaborations reflect a commitment to excellence and creativity in his work.

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