The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Oct. 31, 2008
Sheng-chuan Su, Hsinchu, TW;
Sheng-Chuan Su, Hsinchu, TW;
Chipmos Technologies Inc., Hsinchu, TW;
Chipmos Technologies (Bermuda), Ltd., Hamilton, BM;
Abstract
A conductive structure for a semiconductor integrated circuit is provided. The semiconductor integrated circuit comprises a pad, and a passivation layer partially overlapping the pad, which jointly define an opening portion. The conductive structure is adapted to be electrically connected to the pad through the opening portion. The conductive structure comprises an under bump metal (UBM). A first conductor layer formed on the under bump metal is electrically connected to the under bump metal. A second conductor layer formed on the first conductor layer and electrically connected to the first conductor layer and a cover conductor layer. Furthermore, the under bump metal, the first conductor layer, and the second conductor jointly define a basic bump structure. The cover conductor layer is adapted to cover the basic bump structure.