Company Filing History:
Years Active: 2002-2006
Title: Innovations of Yuan-Ping Tseng
Introduction
Yuan-Ping Tseng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of technology, particularly in the area of conductive substrates and probe card manufacturing. With a total of 11 patents to his name, Tseng's work has had a considerable impact on the industry.
Latest Patents
One of Tseng's latest patents is a method for fabricating an anisotropic conductive substrate. This method involves using a back holder with metal pins on its surface. A liquid compound is formed on the surface of the back holder, and the liquid compound is pressed to deform the metal pins into electrodes. The thickness of the liquid compound is maintained between 25 µm and 250 µm, allowing for effective electrical contact through the exposed ends of the electrodes. Another significant patent is a method for manufacturing probes of a probe card. This method includes the use of a blocking plate on an electroplating tank, which has openings that correspond to the layout of contact pads on a probe head. The process allows for continuous electroplating, resulting in probes that are uniform in elasticity and height, thereby enhancing the quality of electrical contact during wafer probing.
Career Highlights
Throughout his career, Yuan-Ping Tseng has worked with various companies, including Chipmos Technologies Inc. His innovative approaches and methods have contributed to advancements in the technology sector, particularly in the manufacturing processes of electronic components.
Collaborations
Tseng has collaborated with notable individuals in his field, including An-Hong Liu and Yeong-Her Wang. These collaborations have further enriched his work and have led to the development of new technologies.
Conclusion
Yuan-Ping Tseng's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His innovative methods continue to influence the industry and pave the way for future advancements.