The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2006
Filed:
Aug. 20, 2002
S. J. Cheng, Hsinchu, TW;
An-hong Liu, Tainan, TW;
Yeong-her Wang, Tainan, TW;
Yuan-ping Tseng, Hsinchu, TW;
Y. J. Lee, Tainan, TW;
S. J. Cheng, Hsinchu, TW;
An-Hong Liu, Tainan, TW;
Yeong-Her Wang, Tainan, TW;
Yuan-Ping Tseng, Hsinchu, TW;
Y. J. Lee, Tainan, TW;
Chipmos Technologies (Bermuda) Ltd., Hamilton, BM;
Chipmos Technologies Inc., Hsinchu, TW;
Abstract
A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.