S J Cheng

Title: S J Cheng: Innovator in Semiconductor Technology

Introduction

S J Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approaches to manufacturing and design.

Latest Patents

One of his latest patents is titled "Method for manufacturing probes of a probe card." This method involves providing a blocking plate on an electroplating tank, which has multiple openings corresponding to the layout of contact pads on a probe head. The process allows for continuous electroplating after the contact pads interact with the electroplating solution through the openings. By moving the probe head according to the desired shape, probes are formed with good uniformity in elasticity and height, enhancing the quality of electrical contact during wafer probing. This method also reduces process lead time and fabrication costs.

Another significant patent is the "Flip-chip type semiconductor device for reducing signal skew." This invention includes a chip with bonding pads and bumping pads, where each bonding pad is connected to corresponding bumping pads via a metal redistribution trace covered by a passivation layer. The design ensures that each metal trace has an equal length, effectively reducing signal skew.

Career Highlights

Throughout his career, S J Cheng has worked with various companies, including Chipmos Technologies (Bermuda) Ltd. His expertise in semiconductor technology has positioned him as a valuable asset in the industry.

Collaborations

S J Cheng has collaborated with notable colleagues such as An-Hong Liu and Yeong-Her Wang, contributing to advancements in semiconductor innovations.

Conclusion

S J Cheng's contributions to semiconductor technology through his patents reflect his innovative spirit and dedication to improving manufacturing processes. His work continues to influence the industry and enhance the quality of semiconductor devices.