The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 2002
Filed:
Jun. 05, 2001
Applicant:
Inventors:
An-Hong Liu, Tainan, TW;
Yuan-Ping Tseng, Hsinchu, TW;
Assignee:
Chipmos Technologies Inc., , TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/136 ;
U.S. Cl.
CPC ...
H01L 2/136 ;
Abstract
A manufacturing process of semiconductor devices comprises providing at least a wafer, bumping the wafer, testing the wafer, laser repairing, and dicing. The step of testing one bumped wafer is contained after bumping and before laser repairing in order to shorten the procedures and increase throughput