Geng Shin Shen

Title: Geng Shin Shen: Innovator in Semiconductor Packaging

Introduction

Geng Shin Shen is a prominent inventor based in Tainan County, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of six patents. His innovative work focuses on enhancing the thermal performance of electronic packages, which is crucial for the efficiency and reliability of modern electronic devices.

Latest Patents

One of Geng Shin Shen's latest patents is for a thermally enhanced electronic package. This invention comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer, while the insulator fills the gap between the driver chip and the flexible carrier. The carbon nanocapsules are strategically disposed on the driver chip, on the resistant, on the flexible carrier, or within the insulator to enhance heat dissipation in electronic packages.

Another notable patent is related to a method of manufacturing semiconductor packaging. This method involves providing a substrate with a bonding pad, forming a patterned mask layer on the substrate, and creating an opening on the mask layer. A conductive layer is deposited in the opening, followed by the formation of a cap layer on the conductive layer. The mask layer is then removed, allowing the contacting area between the cap layer and the conductive layer to be substantially equal to the top surface area of the conductive layer by reflowing solder material prior to the removal of the mask layer.

Career Highlights

Geng Shin Shen is currently employed at Chipmos Technologies Inc., where he continues to innovate in the semiconductor industry. His work has significantly impacted the development of advanced electronic packaging solutions.

Collaborations

Some of his notable coworkers include Chun Ying Lin and Yu Tang Pan, who collaborate with him on various projects within the company.

Conclusion

Geng Shin Shen is a key figure in the field of semiconductor packaging, with a focus on thermal enhancement technologies. His contributions through innovative patents and collaboration with talented colleagues continue to shape the future of electronic devices.