The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Nov. 18, 2010
Tzu Hsin Huang, Tainan County, TW;
Yu Ting Yang, Tainan County, TW;
Hung Hsin Liu, Tainan County, TW;
An Hong Liu, Tainan County, TW;
Geng Shin Shen, Tainan County, TW;
Wei David Wang, Tainan County, TW;
Shih Fu Lee, Tainan County, TW;
Tzu Hsin Huang, Tainan County, TW;
Yu Ting Yang, Tainan County, TW;
Hung Hsin Liu, Tainan County, TW;
An Hong Liu, Tainan County, TW;
Geng Shin Shen, Tainan County, TW;
Wei David Wang, Tainan County, TW;
Shih Fu Lee, Tainan County, TW;
Chipmos Technologies Inc., Hsinchu, TW;
Abstract
A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.