Location History:
- Tainan County, TW (2013)
- Hsinchu, TW (2016)
Company Filing History:
Years Active: 2013-2016
Title: Innovations of Inventor Hung Hsin Liu
Introduction
Hung Hsin Liu is a notable inventor based in Tainan County, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on enhancing the thermal performance of electronic devices, which is crucial for their efficiency and longevity.
Latest Patents
One of Hung Hsin Liu's latest patents is a thermally enhanced electronic package. This innovative package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer, while the insulator fills the gap between the driver chip and the flexible carrier. The carbon nanocapsules are strategically disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
Career Highlights
Hung Hsin Liu is currently associated with Chipmos Technologies Inc., where he continues to innovate in the field of electronic packaging. His work has been instrumental in developing solutions that address the challenges of heat management in electronic devices.
Collaborations
Some of his notable coworkers include Tzu Hsin Huang and Yu Ting Yang, who collaborate with him on various projects within the company.
Conclusion
Hung Hsin Liu's contributions to the field of electronic packaging through his innovative patents demonstrate his commitment to advancing technology. His work not only enhances the performance of electronic devices but also sets a foundation for future innovations in the industry.